Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 μm width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.
Details
Original language | English |
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Title of host publication | 3rd Electronics System Integration Technology Conference ESTC |
Place of Publication | Berlin |
Publisher | IEEE Xplore |
ISBN (electronic) | 978-1-4244-8554-3, 978-1-4244-8555-0 |
ISBN (print) | 978-1-4244-8553-6 |
Publication status | Published - 2010 |
Peer-reviewed | Yes |
Publication series
Series | Electronics System-Integration Technology Conference, ESTC |
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ISSN | 2687-9700 |
Conference
Title | 3rd Electronics System Integration Technology Conference, ESTC 2010 |
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Duration | 13 - 16 September 2010 |
City | Berlin |
Country | Germany |
External IDs
ORCID | /0000-0002-0757-3325/work/139064954 |
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