Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 μm width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.