Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 μm width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.
Details
Originalsprache | Englisch |
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Titel | 3rd Electronics System Integration Technology Conference ESTC |
Erscheinungsort | Berlin |
Herausgeber (Verlag) | IEEE Xplore |
ISBN (elektronisch) | 978-1-4244-8554-3, 978-1-4244-8555-0 |
ISBN (Print) | 978-1-4244-8553-6 |
Publikationsstatus | Veröffentlicht - 2010 |
Peer-Review-Status | Ja |
Publikationsreihe
Reihe | Electronics System-Integration Technology Conference, ESTC |
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ISSN | 2687-9700 |
Konferenz
Titel | 3rd Electronics System Integration Technology Conference, ESTC 2010 |
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Dauer | 13 - 16 September 2010 |
Stadt | Berlin |
Land | Deutschland |
Externe IDs
ORCID | /0000-0002-0757-3325/work/139064954 |
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