Prospects for energy-efficient edge computing with integrated HfO2-based ferroelectric devices

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

  • Ian Orconnor - , École centrale de Lyon (Author)
  • Mayeul Cantan - , École centrale de Lyon (Author)
  • Cedric Marchand - , École centrale de Lyon (Author)
  • Bertrand Vilquin - , École centrale de Lyon (Author)
  • Stefan Slesazeck - , TUD Dresden University of Technology (Author)
  • Evelyn T. Breyer - , TUD Dresden University of Technology (Author)
  • Halid Mulaosmanovic - , TUD Dresden University of Technology (Author)
  • Thomas Mikolajick - , Chair of Nanoelectronics, TUD Dresden University of Technology (Author)
  • Bastien Giraud - , Université Grenoble Alpes (Author)
  • Jean Philippe Noel - , Université Grenoble Alpes (Author)
  • Adrian Ionescu - , Swiss Federal Institute of Technology Lausanne (EPFL) (Author)
  • Igor Stolichnov - , Swiss Federal Institute of Technology Lausanne (EPFL) (Author)

Abstract

Edge computing requires highly energy efficient microprocessor units with embedded non-volatile memories to process data at IoT sensor nodes. Ferroelectric non-volatile memory devices are fast, low power and high endurance, and could greatly enhance energy-efficiency and allow flexibility for finer grain logic and memory. This paper will describe the basics of ferroelectric devices for both hysteretic (non-volatile memory) and negative capacitance (steep slope switch) devices, and then project how these can be used in low-power logic cell architectures and fine-grain logic-in-memory (LiM) circuits.

Details

Original languageEnglish
Title of host publicationProceedings of the 2018 26th IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018
PublisherIEEE Computer Society, Washington
Pages180-183
Number of pages4
ISBN (electronic)9781538647561
Publication statusPublished - 19 Feb 2019
Peer-reviewedYes

Publication series

SeriesIEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC
Volume2018-October
ISSN2324-8432

Conference

Title2018 IFIP/IEEE 26th International Conference on Very Large Scale Integration
Abbreviated titleVLSI-SoC 2018
Conference number26
Duration8 - 10 October 2018
CityVerona
CountryItaly

External IDs

ORCID /0000-0003-3814-0378/work/142256242

Keywords

Sustainable Development Goals

Keywords

  • Ferroelectric devices, Logic-in-memory, Low-power logic, Non-volatile memory, Steep slope switch