Properties of conductive microstructures containing nano sized silver particles

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Contributors

  • Jan Felba - , Wrocław University of Science and Technology (Author)
  • Karol Nitsch - , Wrocław University of Science and Technology (Author)
  • Tomasz Piasecki - , Wrocław University of Science and Technology (Author)
  • Sebastian Tesarski - , Wrocław University of Science and Technology (Author)
  • Andrzej Moscicki - , Amepox Microelectronics, Ltd (Author)
  • Andrzej Kinart - , Amepox Microelectronics, Ltd (Author)
  • Detlef Bonfert - , Fraunhofer Institute for Reliability and Microintegration (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Institute for Reliability and Microintegration (Author)

Abstract

The properties of the structures made by ink-jet printing with the use of the ink containing nano silver sized particles are presented. After structures printing on substrate, to obtain good electrical conductivity, sintering process is necessary. It is shown, that thermal process influences strongly the resistance, and after the process the resistivity of printed structures can be only a little bit higher than the value of the bulk material. Also different electrical test proved similarity between printed and bulk silver. It was stated that the adding some polymer materials for mechanical parameters improving of printed materials up to 1.5% of total mass of the ink do not influence significantly electrical parameters of the printed layers.

Details

Original languageGerman
Title of host publication2009 11th Electronics Packaging Technology Conference
PublisherIEEE
Pages879-883
Number of pages5
ISBN (print)978-1-4244-5100-5
Publication statusPublished - 11 Dec 2009
Peer-reviewedYes

Conference

Title2009 11th Electronics Packaging Technology Conference
Duration9 - 11 December 2009
LocationSingapore

External IDs

Scopus 77950928877
ORCID /0000-0002-0757-3325/work/139064833

Keywords

Keywords

  • Microstructure, Silver, Ink, Conductivity, Conducting materials, Protection, Printing, Electric resistance, Temperature distribution, Electronic equipment testing