Properties of conductive microstructures containing nano sized silver particles
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
The properties of the structures made by ink-jet printing with the use of the ink containing nano silver sized particles are presented. After structures printing on substrate, to obtain good electrical conductivity, sintering process is necessary. It is shown, that thermal process influences strongly the resistance, and after the process the resistivity of printed structures can be only a little bit higher than the value of the bulk material. Also different electrical test proved similarity between printed and bulk silver. It was stated that the adding some polymer materials for mechanical parameters improving of printed materials up to 1.5% of total mass of the ink do not influence significantly electrical parameters of the printed layers.
Details
Original language | German |
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Title of host publication | 2009 11th Electronics Packaging Technology Conference |
Publisher | IEEE |
Pages | 879-883 |
Number of pages | 5 |
ISBN (print) | 978-1-4244-5100-5 |
Publication status | Published - 11 Dec 2009 |
Peer-reviewed | Yes |
Conference
Title | 2009 11th Electronics Packaging Technology Conference |
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Duration | 9 - 11 December 2009 |
Location | Singapore |
External IDs
Scopus | 77950928877 |
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ORCID | /0000-0002-0757-3325/work/139064833 |
Keywords
Keywords
- Microstructure, Silver, Ink, Conductivity, Conducting materials, Protection, Printing, Electric resistance, Temperature distribution, Electronic equipment testing