Properties of conductive microstructures containing nano sized silver particles
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
The properties of the structures made by ink-jet printing with the use of the ink containing nano silver sized particles are presented. After structures printing on substrate, to obtain good electrical conductivity, sintering process is necessary. It is shown, that thermal process influences strongly the resistance, and after the process the resistivity of printed structures can be only a little bit higher than the value of the bulk material. Also different electrical test proved similarity between printed and bulk silver. It was stated that the adding some polymer materials for mechanical parameters improving of printed materials up to 1.5% of total mass of the ink do not influence significantly electrical parameters of the printed layers.
Details
Originalsprache | Deutsch |
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Titel | 2009 11th Electronics Packaging Technology Conference |
Herausgeber (Verlag) | IEEE |
Seiten | 879-883 |
Seitenumfang | 5 |
ISBN (Print) | 978-1-4244-5100-5 |
Publikationsstatus | Veröffentlicht - 11 Dez. 2009 |
Peer-Review-Status | Ja |
Konferenz
Titel | 2009 11th Electronics Packaging Technology Conference |
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Dauer | 9 - 11 Dezember 2009 |
Ort | Singapore |
Externe IDs
Scopus | 77950928877 |
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ORCID | /0000-0002-0757-3325/work/139064833 |
Schlagworte
Schlagwörter
- Microstructure, Silver, Ink, Conductivity, Conducting materials, Protection, Printing, Electric resistance, Temperature distribution, Electronic equipment testing