Properties of conductive microstructures containing nano sized silver particles

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • Jan Felba - , Wrocław University of Science and Technology (Autor:in)
  • Karol Nitsch - , Wrocław University of Science and Technology (Autor:in)
  • Tomasz Piasecki - , Wrocław University of Science and Technology (Autor:in)
  • Sebastian Tesarski - , Wrocław University of Science and Technology (Autor:in)
  • Andrzej Moscicki - , Amepox Microelectronics, Ltd (Autor:in)
  • Andrzej Kinart - , Amepox Microelectronics, Ltd (Autor:in)
  • Detlef Bonfert - , Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Autor:in)
  • Karlheinz Bock - , Professur für Aufbau- und Verbindungstechnik der Elektronik, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Autor:in)

Abstract

The properties of the structures made by ink-jet printing with the use of the ink containing nano silver sized particles are presented. After structures printing on substrate, to obtain good electrical conductivity, sintering process is necessary. It is shown, that thermal process influences strongly the resistance, and after the process the resistivity of printed structures can be only a little bit higher than the value of the bulk material. Also different electrical test proved similarity between printed and bulk silver. It was stated that the adding some polymer materials for mechanical parameters improving of printed materials up to 1.5% of total mass of the ink do not influence significantly electrical parameters of the printed layers.

Details

OriginalspracheDeutsch
Titel2009 11th Electronics Packaging Technology Conference
Herausgeber (Verlag)IEEE
Seiten879-883
Seitenumfang5
ISBN (Print)978-1-4244-5100-5
PublikationsstatusVeröffentlicht - 11 Dez. 2009
Peer-Review-StatusJa

Konferenz

Titel2009 11th Electronics Packaging Technology Conference
Dauer9 - 11 Dezember 2009
OrtSingapore

Externe IDs

Scopus 77950928877
ORCID /0000-0002-0757-3325/work/139064833

Schlagworte

Schlagwörter

  • Microstructure, Silver, Ink, Conductivity, Conducting materials, Protection, Printing, Electric resistance, Temperature distribution, Electronic equipment testing