Packaging technologies for flexible systems

Research output: Contribution to journal › Conference article › Contributed › peer-review

Contributors

  • Christine Kallmayer - , Fraunhofer Institute for Reliability and Microintegration (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Institute for Reliability and Microintegration (Author)
  • Rolf Aschenbrenner - , Fraunhofer Institute for Reliability and Microintegration (Author)
  • Herbert Reichl - , Fraunhofer Institute for Reliability and Microintegration (Author)

Details

Original languageEnglish
Pages (from-to)43-45
Number of pages3
Journal Proceedings of SPIE - The International Society for Optical Engineering
Volume4828
Publication statusPublished - 2002
Peer-reviewedYes

Conference

TitleInternational Conference on Advanced Packaging and Systems (ICAPS 2002)
Duration10 - 13 March 2002
CityReno, NV
CountryUnited States of America

External IDs

ORCID /0000-0002-0757-3325/work/139064978

Keywords

ASJC Scopus subject areas