Modular solid state technologies for a multi-functional system integration
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
A trend in system integration aims for human centered and environmental solutions and therefore need to focus more on multifunctional interfaces for smart systems in order to develop tailored solutions. A modular merge of different technology concepts CMOS, MEMS, HF ICs (III-V, II-VI...) 3D system integration on interposer, wafer and board level takes place in order to design application oriented interfaces amongst the major existing technologies for such a multi-functional systems integration. First add-on technologies will be the dominant system integration technology in the near future and in a second wave a kind of modular solid state technology might develop building the base for highperformance multi-functional systems.
Details
Original language | English |
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Title of host publication | 2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011 |
Publisher | CS MANTECH |
ISBN (print) | 1893580172, 9781893580176 |
Publication status | Published - 2011 |
Peer-reviewed | Yes |
Publication series
Series | 2011 International Conference on Compound Semiconductor Manufacturing Technology |
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Conference
Title | 2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011 |
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Duration | 16 - 19 May 2011 |
City | Palm Springs, CA |
Country | United States of America |
External IDs
ORCID | /0000-0002-0757-3325/work/139064813 |
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Keywords
ASJC Scopus subject areas
Keywords
- Cmos, Hetero-system integration, Mems, Modular solid state technology (msst), Multi-functional on-top technologies (mott), Multifunctional systems, Polytronic