A trend in system integration aims for human centered and environmental solutions and therefore need to focus more on multifunctional interfaces for smart systems in order to develop tailored solutions. A modular merge of different technology concepts CMOS, MEMS, HF ICs (III-V, II-VI...) 3D system integration on interposer, wafer and board level takes place in order to design application oriented interfaces amongst the major existing technologies for such a multi-functional systems integration. First add-on technologies will be the dominant system integration technology in the near future and in a second wave a kind of modular solid state technology might develop building the base for highperformance multi-functional systems.