Large area multilayer foil assembly for flexible electronic systems

Research output: Contribution to conferencesPaperContributedpeer-review

Contributors

  • E. Yacoub-George - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • A. Ohlander - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • L. Meixner - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • D. Bollmann - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • R. Faul - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • C. Landesberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • K. Bock - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Details

Original languageEnglish
Publication statusPublished - 2011
Peer-reviewedYes

Conference

TitleSmart Systems Integration Conference 2011, SSI 2011
Duration22 - 23 March 2011
CityDresden
CountryGermany

External IDs

ORCID /0000-0002-0757-3325/work/139064947