Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a “system in foil”
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Details
Original language | English |
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Title of host publication | Smart Systems Integration - 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, SSI 2014 |
Editors | Thomas Gessner |
Publisher | Apprimus Verlag |
Pages | 131-138 |
Number of pages | 8 |
ISBN (electronic) | 9783863592011 |
Publication status | Published - 2014 |
Peer-reviewed | Yes |
Publication series
Series | Smart systems integration : European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components |
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Conference
Title | Smart Systems Integration - 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2014 |
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Duration | 26 - 27 March 2014 |
City | Vienna |
Country | Austria |
External IDs
ORCID | /0000-0002-0757-3325/work/139064929 |
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