Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a “system in foil”

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Contributors

  • Erwin Yacoub-George - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Andreas Drost - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Dieter Hemmetzberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Dieter Bollmann - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Robert Faul - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Details

Original languageEnglish
Title of host publicationSmart Systems Integration - 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, SSI 2014
EditorsThomas Gessner
PublisherApprimus Verlag
Pages131-138
Number of pages8
ISBN (electronic)9783863592011
Publication statusPublished - 2014
Peer-reviewedYes

Publication series

SeriesSmart Systems Integration Conference

Conference

TitleSmart Systems Integration - 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2014
Duration26 - 27 March 2014
CityVienna
CountryAustria

External IDs

ORCID /0000-0002-0757-3325/work/139064929

Keywords

ASJC Scopus subject areas