Interflex: Reliable integration technologies for building a system-in-foil

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

  • Erwin Yacoub-George - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Robert Faul - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Details

Original languageEnglish
Publication statusPublished - 2013
Peer-reviewedYes

Conference

TitleSmart Systems Integration Conference 2013 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2013
Duration13 - 14 March 2013
CityAmsterdam, North Holland
CountryNetherlands

External IDs

ORCID /0000-0002-0757-3325/work/139064937

Keywords

ASJC Scopus subject areas