HZO-based Nonvolatile SRAM Array with 100% Bit Recall Yield and Sufficient Retention Time at 85°C

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

  • Yusuke Shuto - , Sony Group Corporation (Author)
  • Jun Okuno - , Sony Group Corporation (Author)
  • Tsubasa Yonai - , Sony Group Corporation (Author)
  • Ryo Ono - , Sony Group Corporation (Author)
  • Peter Reinig - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Maximilian Lederer - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Konrad Seidel - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Ruben Alcala - , NaMLab - Nanoelectronic materials laboratory gGmbH (Author)
  • Thomas Mikolajick - , Chair of Nanoelectronics, NaMLab - Nanoelectronic materials laboratory gGmbH (Author)
  • Uwe Schroeder - , NaMLab - Nanoelectronic materials laboratory gGmbH (Author)
  • Taku Umebayashi - , Sony Group Corporation (Author)
  • Kentaro Akiyama - , Sony Group Corporation (Author)

Abstract

For the first time, a 16-Kbit nonvolatile SRAM (NVSRAM) array based on a metal/ferroelectric/metal capacitor using a sub-10-nm-thick HfZrOx (HZO) layer has been experimentally demonstrated to obtain 100% bit yield. This capacitor is formed using the same integration process as that of a previously developed ferroelectric random-access memory (FeRAM) array on the same wafer. Its sequential operations of nonvolatile data store (Store), cutoff of power supply (power-gating: PG), and data recall (Recall) are completely executed employing a robust Recall sequence, achieving 100%-bit recall after a 200-s PG period at 85 ° C even with sufficiently low operation voltage. The results indicate that our HZO-based NVSRAM and FeRAM hybrid memory system can provide ultra-low power advantages in a System-on-Chip for Internet of Things edge computing.

Details

Original languageEnglish
Title of host publication2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1-2
ISBN (electronic)979-8-3503-6146-9
Publication statusPublished - 2024
Peer-reviewedYes

Publication series

SeriesDigest of Technical Papers - Symposium on VLSI Technology
ISSN0743-1562

Conference

Title2024 IEEE Symposium on VLSI Technology and Circuits
SubtitleBridging the Digital & Physical Worlds with efficiency & intelligence
Abbreviated titleVLSI Technology and Circuits 2024
Duration16 - 20 June 2024
Website
LocationHilton Hawaiian Village
CityHonolulu
CountryUnited States of America

External IDs

ORCID /0000-0003-3814-0378/work/180371973
unpaywall 10.1109/vlsitechnologyandcir46783.2024.10631328

Keywords

ASJC Scopus subject areas

Keywords

  • ferroelectric capacitor, hafnium oxide, nonvolatile SRAM, power-gating