HZO-based Nonvolatile SRAM Array with 100% Bit Recall Yield and Sufficient Retention Time at 85°C

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • Yusuke Shuto - , Sony Group Corporation (Autor:in)
  • Jun Okuno - , Sony Group Corporation (Autor:in)
  • Tsubasa Yonai - , Sony Group Corporation (Autor:in)
  • Ryo Ono - , Sony Group Corporation (Autor:in)
  • Peter Reinig - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • Maximilian Lederer - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • Konrad Seidel - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • Ruben Alcala - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Thomas Mikolajick - , Professur für Nanoelektronik, NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Uwe Schroeder - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Taku Umebayashi - , Sony Group Corporation (Autor:in)
  • Kentaro Akiyama - , Sony Group Corporation (Autor:in)

Abstract

For the first time, a 16-Kbit nonvolatile SRAM (NVSRAM) array based on a metal/ferroelectric/metal capacitor using a sub-10-nm-thick HfZrOx (HZO) layer has been experimentally demonstrated to obtain 100% bit yield. This capacitor is formed using the same integration process as that of a previously developed ferroelectric random-access memory (FeRAM) array on the same wafer. Its sequential operations of nonvolatile data store (Store), cutoff of power supply (power-gating: PG), and data recall (Recall) are completely executed employing a robust Recall sequence, achieving 100%-bit recall after a 200-s PG period at 85 ° C even with sufficiently low operation voltage. The results indicate that our HZO-based NVSRAM and FeRAM hybrid memory system can provide ultra-low power advantages in a System-on-Chip for Internet of Things edge computing.

Details

OriginalspracheEnglisch
Titel2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers (IEEE)
Seiten1-2
ISBN (elektronisch)979-8-3503-6146-9
PublikationsstatusVeröffentlicht - 2024
Peer-Review-StatusJa

Publikationsreihe

ReiheDigest of Technical Papers - Symposium on VLSI Technology
ISSN0743-1562

Konferenz

Titel2024 IEEE Symposium on VLSI Technology and Circuits
UntertitelBridging the Digital & Physical Worlds with efficiency & intelligence
KurztitelVLSI Technology and Circuits 2024
Dauer16 - 20 Juni 2024
Webseite
OrtHilton Hawaiian Village
StadtHonolulu
LandUSA/Vereinigte Staaten

Externe IDs

ORCID /0000-0003-3814-0378/work/180371973
unpaywall 10.1109/vlsitechnologyandcir46783.2024.10631328

Schlagworte

ASJC Scopus Sachgebiete

Schlagwörter

  • ferroelectric capacitor, hafnium oxide, nonvolatile SRAM, power-gating