Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level

Research output: Contribution to conferences › Presentation slides › Invited › peer-review

Contributors

Juliana Panchenko - , Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Laura Wenzel - , Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Steffen Bickel - , Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Catharina Rudolph - , Fraunhofer Institute for Reliability and Microintegration (Author)
Adil Shehzad - , Fraunhofer Institute for Reliability and Microintegration (Author)

Title	17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
Subtitle	Stress workshop
Abbreviated title	IRSP 2023
Conference number	17
Duration	24 - 26 April 2023
Website	https://irsp2023.com/
Location	Hotel Elbresidenz
City	Bad Schandau
Country	Germany

ORCID	/0000-0001-8576-7611/work/187997184