High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces

Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed › peer-review

Contributors

  • Christof Landesberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Mitsuru Hiroshima - , Panasonic Corporation (Author)
  • Josef Weber - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Details

Original languageEnglish
Title of host publication3D Process Technology
PublisherWiley-Blackwell, Berlin
Pages335-344
Number of pages10
Volume3
ISBN (electronic)9783527670109
ISBN (print)9783527334667
Publication statusPublished - 21 Jul 2014
Peer-reviewedYes

External IDs

ORCID /0000-0002-0757-3325/work/139064931

Keywords

ASJC Scopus subject areas

Keywords

  • Chip bonding, Dicing-by-thinning, Plasma treatment, Polymers, Self-alignment, Self-assembly, Self-assembly techniques, Silicon chips, Surface programming, Thin dies