Heterointegration technologies for system in a foil

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Contributors

Abstract

This paper presents an overview of the hybrid hetero-integration approach for flexible electronic foil systems so-called "Polytronics or Smart Plastics". Core of the process is a hybrid approach based on most-polymer materials and partially-(im-)printed technologies to reach reasonable performance of systems. Moreover this approach enables the possibility to process directly on functional flexible foil substrates and to enable large area electronics.

Details

Original languageEnglish
Title of host publication2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
PublisherCS MANTECH
ISBN (print)1893580113, 9781893580114
Publication statusPublished - 2008
Peer-reviewedYes

Publication series

Series 2008 International Conference on Compound Semiconductor Manufacturing Technology

Conference

Title23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
Duration14 - 17 April 2008
CityChicago, IL
CountryUnited States of America

External IDs

ORCID /0000-0002-0757-3325/work/139064815

Keywords

Keywords

  • Flexible foil systems, Hetero-integration, Large area electronics, Low cost production, Organic materials