Heterointegration technologies for system in a foil
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
This paper presents an overview of the hybrid hetero-integration approach for flexible electronic foil systems so-called "Polytronics or Smart Plastics". Core of the process is a hybrid approach based on most-polymer materials and partially-(im-)printed technologies to reach reasonable performance of systems. Moreover this approach enables the possibility to process directly on functional flexible foil substrates and to enable large area electronics.
Details
Original language | English |
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Title of host publication | 2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008 |
Publisher | CS MANTECH |
ISBN (print) | 1893580113, 9781893580114 |
Publication status | Published - 2008 |
Peer-reviewed | Yes |
Publication series
Series | 2008 International Conference on Compound Semiconductor Manufacturing Technology |
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Conference
Title | 23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008 |
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Duration | 14 - 17 April 2008 |
City | Chicago, IL |
Country | United States of America |
External IDs
ORCID | /0000-0002-0757-3325/work/139064815 |
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Keywords
ASJC Scopus subject areas
Keywords
- Flexible foil systems, Hetero-integration, Large area electronics, Low cost production, Organic materials