Heterointegration technologies for system in a foil

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

Abstract

This paper presents an overview of the hybrid hetero-integration approach for flexible electronic foil systems so-called "Polytronics or Smart Plastics". Core of the process is a hybrid approach based on most-polymer materials and partially-(im-)printed technologies to reach reasonable performance of systems. Moreover this approach enables the possibility to process directly on functional flexible foil substrates and to enable large area electronics.

Details

OriginalspracheEnglisch
Titel2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
Herausgeber (Verlag)CS MANTECH
ISBN (Print)1893580113, 9781893580114
PublikationsstatusVeröffentlicht - 2008
Peer-Review-StatusJa

Publikationsreihe

Reihe 2008 International Conference on Compound Semiconductor Manufacturing Technology

Konferenz

Titel23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
Dauer14 - 17 April 2008
StadtChicago, IL
LandUSA/Vereinigte Staaten

Externe IDs

ORCID /0000-0002-0757-3325/work/139064815

Schlagworte

Schlagwörter

  • Flexible foil systems, Hetero-integration, Large area electronics, Low cost production, Organic materials