Heterointegration technologies for system in a foil
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
This paper presents an overview of the hybrid hetero-integration approach for flexible electronic foil systems so-called "Polytronics or Smart Plastics". Core of the process is a hybrid approach based on most-polymer materials and partially-(im-)printed technologies to reach reasonable performance of systems. Moreover this approach enables the possibility to process directly on functional flexible foil substrates and to enable large area electronics.
Details
Originalsprache | Englisch |
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Titel | 2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008 |
Herausgeber (Verlag) | CS MANTECH |
ISBN (Print) | 1893580113, 9781893580114 |
Publikationsstatus | Veröffentlicht - 2008 |
Peer-Review-Status | Ja |
Publikationsreihe
Reihe | 2008 International Conference on Compound Semiconductor Manufacturing Technology |
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Konferenz
Titel | 23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008 |
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Dauer | 14 - 17 April 2008 |
Stadt | Chicago, IL |
Land | USA/Vereinigte Staaten |
Externe IDs
ORCID | /0000-0002-0757-3325/work/139064815 |
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Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- Flexible foil systems, Hetero-integration, Large area electronics, Low cost production, Organic materials