Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
We report a Finite Element Model to calculate the bending stress of thin and ultra-thin silicon dies embedded in flexible foil substrates (chip-in-foil package) at lower bending radii. The values of fracture strength computed using Finite Element Analysis showed very good agreement with the experimental results. Furthermore, an increase in the fracture or critical stress (bending stress at fracture) of the dies due to embedding in flexible foil substrates was observed. Besides, the impact of foil material and thickness on the bending stress of ultra-thin silicon die is discussed by comparing two foil materials: Stainless Steel and Polyimide.
Details
Original language | German |
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Title of host publication | 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) |
Place of Publication | Glasgow |
Publisher | IEEE |
Pages | 137-140 |
Number of pages | 4 |
ISBN (electronic) | 978-1-4799-8229-5, 978-1-4799-8228-8 |
Publication status | Published - 2 Jul 2015 |
Peer-reviewed | Yes |
Publication series
Series | Ph.D. Research in Microelectronics and Electronics (PRIME) |
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ISSN | 2641-5933 |
Conference
Title | 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) |
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Duration | 29 June - 2 July 2015 |
Location | Glasgow, UK |
External IDs
Scopus | 84946846036 |
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ORCID | /0000-0002-0757-3325/work/139064859 |
Keywords
Keywords
- Silicon, Stress, Finite element analysis, Steel, Polyimides, Substrates, Flexible electronics