Electrostatic wafer handling for thin wafer processing
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
Mobile electrostatic carriers, so called e-carriers, offer a new and promising technical solution for simple and reversible attachment of thin wafers onto support substrates. The paper reports on latest developments in manufacture of e-carriers based on silicon wafers with through substrate vias and backside contact pads. Thermal and electrical characterizations of e-carries have proven very low leakage currents at temperatures up to 300 °C. These new types of e-carriers enable long term electrostatic holding capabilities. It is also shown that electrical properties of transistor devices are not changed when CMOS wafers are attached onto e-carriers, neither in face up nor face down attachment configuration. Furthermore, the paper proposes a technical concept how electrostatic support technique can be used for thin wafer processing in wet-chemical environments. E-carriers can also be applied for reversibly bonding of single chip devices onto a carrier substrate. The paper explains how this feature can be used in chip to wafer stacking for 3d integrated systems.
Details
Original language | English |
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Title of host publication | 2009 European Microelectronics and Packaging Conference |
Place of Publication | Rimini |
Publisher | IEEE Xplore |
ISBN (electronic) | 978-0-6152-9868-9 |
ISBN (print) | 978-1-4244-4722-0 |
Publication status | Published - 2009 |
Peer-reviewed | Yes |
Publication series
Series | European Microelectronics and Packaging Conference, EMPC |
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Conference
Title | 2009 European Microelectronics and Packaging Conference, EMPC 2009 |
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Duration | 15 - 18 June 2009 |
City | Rimini |
Country | Italy |
External IDs
ORCID | /0000-0002-0757-3325/work/139064959 |
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Keywords
ASJC Scopus subject areas
Keywords
- Carrier substrates, E-carriers, Thin wafer technology, Ultra-thin wafer processing