Electronic module assembly
Research output: Contribution to journal › Research article › Contributed › peer-review
Contributors
Abstract
Electronics is the vital basis for innovations and the essential enabler for global trends like connectivity, electro mobility and renewable energies. These applications require high performance and reliability of the electronic modules. Their assembly combines very heterogeneous process chains like remarkable productive and diminutive surface mount technology (SMT), powerful and robust power electronic interconnection techniques, as well as pioneering reel-to-reel based organic electronic printing. After briefly outlining the enormous global economic impact of electronic modules, this paper presents the state of the art of electronic module assembly including substrate materials, electronic components, packaging and assembly processes as well as quality and reliability testing methods.
Details
Original language | English |
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Pages (from-to) | 471-493 |
Number of pages | 23 |
Journal | CIRP Annals - Manufacturing Technology |
Volume | 70 |
Issue number | 2 |
Publication status | Published - Jan 2021 |
Peer-reviewed | Yes |
External IDs
Scopus | 85109712001 |
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ORCID | /0000-0002-0757-3325/work/139064761 |
Keywords
Sustainable Development Goals
Keywords
- Assembly, Electronic, Joining