Electronic module assembly

Research output: Contribution to journalResearch articleContributedpeer-review

Contributors

  • Jörg Franke - , Friedrich-Alexander University Erlangen-Nürnberg (Author)
  • Lihui Wang - , KTH Royal Institute of Technology (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology (Author)
  • Jürgen Wilde - , University of Freiburg (Author)

Abstract

Electronics is the vital basis for innovations and the essential enabler for global trends like connectivity, electro mobility and renewable energies. These applications require high performance and reliability of the electronic modules. Their assembly combines very heterogeneous process chains like remarkable productive and diminutive surface mount technology (SMT), powerful and robust power electronic interconnection techniques, as well as pioneering reel-to-reel based organic electronic printing. After briefly outlining the enormous global economic impact of electronic modules, this paper presents the state of the art of electronic module assembly including substrate materials, electronic components, packaging and assembly processes as well as quality and reliability testing methods.

Details

Original languageEnglish
Pages (from-to)471-493
Number of pages23
JournalCIRP Annals - Manufacturing Technology
Volume70
Issue number2
Publication statusPublished - Jan 2021
Peer-reviewedYes

External IDs

Scopus 85109712001
ORCID /0000-0002-0757-3325/work/139064761

Keywords

Sustainable Development Goals

Keywords

  • Assembly, Electronic, Joining

Library keywords