Electronic module assembly

Publikation: Beitrag in FachzeitschriftForschungsartikelBeigetragenBegutachtung

Beitragende

Abstract

Electronics is the vital basis for innovations and the essential enabler for global trends like connectivity, electro mobility and renewable energies. These applications require high performance and reliability of the electronic modules. Their assembly combines very heterogeneous process chains like remarkable productive and diminutive surface mount technology (SMT), powerful and robust power electronic interconnection techniques, as well as pioneering reel-to-reel based organic electronic printing. After briefly outlining the enormous global economic impact of electronic modules, this paper presents the state of the art of electronic module assembly including substrate materials, electronic components, packaging and assembly processes as well as quality and reliability testing methods.

Details

OriginalspracheEnglisch
Seiten (von - bis)471-493
Seitenumfang23
FachzeitschriftCIRP Annals - Manufacturing Technology
Jahrgang70
Ausgabenummer2
PublikationsstatusVeröffentlicht - Jan. 2021
Peer-Review-StatusJa

Externe IDs

Scopus 85109712001
ORCID /0000-0002-0757-3325/work/139064761

Schlagworte

Ziele für nachhaltige Entwicklung

Schlagwörter

  • Assembly, Electronic, Joining

Bibliotheksschlagworte