Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review

Contributors

  • Nagarajan Palavesam - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT), Technical University of Munich (Author)
  • Detlef Bonfert - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Waltraud Hell - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Christof Landesberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Horst Gieser - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Christoph Kutter - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, TUD Dresden University of Technology, Structure and Materials Mechanics Research Institute at the Dresden University of Technology (SWM) (Author)

Abstract

We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.

Details

Original languageGerman
Title of host publication2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)
PublisherIEEE
Pages367-372
Number of pages6
ISBN (print)978-1-5090-0331-0
Publication statusPublished - 25 Oct 2015
Peer-reviewedYes

Conference

Title2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)
Duration22 - 25 October 2015
LocationBrasov, Romania

External IDs

Scopus 84960385804
ORCID /0000-0002-0757-3325/work/139064860

Keywords

Keywords

  • Electrical resistance measurement, Resistance, Stress, Performance evaluation, Assembly, Semiconductor device measurement, Aluminum