Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.
Details
| Originalsprache | Deutsch |
|---|---|
| Titel | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Herausgeber (Verlag) | IEEE |
| Seiten | 367-372 |
| Seitenumfang | 6 |
| ISBN (Print) | 978-1-5090-0331-0 |
| Publikationsstatus | Veröffentlicht - 25 Okt. 2015 |
| Peer-Review-Status | Ja |
Konferenz
| Titel | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) |
|---|---|
| Dauer | 22 - 25 Oktober 2015 |
| Ort | Brasov, Romania |
Externe IDs
| Scopus | 84960385804 |
|---|---|
| ORCID | /0000-0002-0757-3325/work/139064860 |
Schlagworte
Schlagwörter
- Electrical resistance measurement, Resistance, Stress, Performance evaluation, Assembly, Semiconductor device measurement, Aluminum