Drift-Diffusion Simulation for Quantitative Interpretation of STEM-EBIC on FIB-Prepared Silicon p-n Junctions

Research output: Contribution to conferences › Presentation slides › Contributed › peer-review

Contributors

  • Transregio 404: Next Generation Electronics With Active Devices in Three Dimensions

Abstract

in Reliability and Transport Modeling Session

Details

Original languageEnglish
Publication statusPublished - 2026
Peer-reviewedYes

Conference

Title52nd IEEE European Solid-State Electronics Research Conference
SubtitleAdvancing Chips, Advancing Europe
Abbreviated titleESSERC 2026
Conference number52
Duration7 - 10 September 2026
Website
LocationAuditorium de Palma
CityPalma de Mallorca
CountrySpain

Keywords

Research priority areas of TU Dresden

Keywords

  • C02