Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Abstract

This paper focuses on developing efficient models based on the Finite Element Method for data synthesis that is useful for solder joint reliability predictions under vibration tests. Starting from an existing detailed 3D Finite Element model of a vibration test vehicle assembled with Flip Chip components, efficiency optimized models were generated. Models were simplified to make use of periodically present structures. The equivalent inelastic strain occurring in the corner solder joints of the Flip Chip components was extracted from the simulation results and was further evaluated to assess the simulation accuracy. While cutting the calculation time down to 9 minutes, the modifications introduced strain result deviations that however did not exceed 15%. Replacing volume elements in thin structures with shell elements helped to significantly reduce the number of elements and nodes, thus shortening the calculation time. Additionally, implementing a submodeling approach did significantly reduce the calculation time, too.

Details

Original languageGerman
Title of host publication2024 47th International Spring Seminar on Electronics Technology (ISSE)
PublisherIEEE
Pages1-6
Number of pages6
Volume2024
ISBN (electronic)9798350385472
ISBN (print)979-8-3503-8548-9
Publication statusPublished - 19 May 2024
Peer-reviewedYes

Conference

Title2024 47th International Spring Seminar on Electronics Technology (ISSE)
Duration15 - 19 May 2024
LocationPrague, Czech Republic

External IDs

ORCID /0000-0002-0757-3325/work/165062968
Scopus 85200458978

Keywords

Keywords

  • Accuracy, Computational modeling, Finite element analysis, Numerical models, Solid modeling, Three-dimensional displays, Vibrations