Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
The development of long-term implantable microsystems requires biocompatible packaging. Although several approaches using biocompatible polymers for encapsulation of flexible electronics have been demonstrated, there has not been found a hermetic solution yet as it is a state of the art for rigid titanium or ceramic packages. Besides numerous, advantageous properties for flexible microsystem packaging, polymers are just partly able to provide a sealed encapsulation for long-term implantation due to their permeability to water and certain ions. This paper proposes a novel in vitro test setup to characterize the behavior of polymeric encapsulation and hence their protective function for electronics in artificial body fluids. That allows monitoring the variation of values of the impedance and leakage current of specimen, which were placed under fluidic and electrical stress for a test period of 30 days. The protective function of polyimide PI 2611 and epoxy resin EPO-TEK 310M has been investigated, with the polyimide showing the best performance.
Details
Original language | German |
---|---|
Title of host publication | 2015 38th International Spring Seminar on Electronics Technology (ISSE) |
Publisher | IEEE |
Pages | 129-133 |
Number of pages | 5 |
ISBN (print) | 978-1-4799-8859-4 |
Publication status | Published - 10 May 2015 |
Peer-reviewed | Yes |
Conference
Title | 2015 38th International Spring Seminar on Electronics Technology |
---|---|
Subtitle | Novel Trends in Electronics Manufacturing |
Abbreviated title | ISSE 2015 |
Conference number | 38 |
Duration | 6 - 10 May 2015 |
Location | Egerszalók Saliris Hotel |
City | Eger |
Country | Hungary |
External IDs
Scopus | 84958152977 |
---|---|
ORCID | /0000-0002-0757-3325/work/139064858 |
Keywords
Keywords
- Encapsulation, Polyimides, Fluids, Leakage currents, Epoxy resins