Challenges and Perspectives for Energy-efficient Brain-inspired Edge Computing Applications (Invited Paper)

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionInvitedpeer-review

Contributors

  • Erika Covi - , TUD Dresden University of Technology (Author)
  • Suzanne Lancaster - , TUD Dresden University of Technology (Author)
  • Stefan Slesazeck - , TUD Dresden University of Technology (Author)
  • Veeresh Deshpande - , Helmholtz Centre Berlin for Materials and Energy (Author)
  • Thomas Mikolajick - , Chair of Nanoelectronics (Author)
  • Catherine Dubourdieu - , Helmholtz Centre Berlin for Materials and Energy, Free University of Berlin (Author)

Abstract

In recent years, Artificial Intelligence has shifted towards edge computing paradigm, where systems compute data in real-time on the edge of the network, close to the sensor that acquires them. The requirements of a system operating on the edge are very tight: power efficiency, low area footprint, fast response times, and online learning. Moreover, in order to fully optimise sensor performance and broaden applications by developing smart wearable and implantable devices, solutions must be compatible with flexible substrates. Brain-inspired architectures such as Spiking Neural Networks (SNNs) use artificial neurons and synapses that perform low-latency computation and internal-state storage simultaneously with very low power consumption. However, SNNs at present are mainly implemented on standard CMOS technologies, which makes it challenging to meet the above-mentioned constraints. In this respect, memristive technology has shown promising results, due to its ability to support fast and energy-efficient non-volatile storage of the SNN parameters in a nanoscale footprint. In this perspective work, the main challenges to achieve a neuromorphic-memristive hardware are presented, particularly in the context of optimising such systems for applications on the edge. The aspects to be considered for integration with flexible substrates will also be discussed.

Details

Original languageEnglish
Title of host publication2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (electronic)978-1-6654-4273-2
ISBN (print)978-1-6654-4274-9
Publication statusPublished - 2022
Peer-reviewedYes

Publication series

SeriesIEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Conference

Title4th IEEE International Conference on Flexible and Printable Sensors and Systems
Abbreviated titleFLEPS 2022
Conference number4
Duration10 - 13 July 2022
Website
Degree of recognitionInternational event
LocationTechnische Universität Wien
CityWien
CountryAustria

External IDs

ORCID /0000-0003-3814-0378/work/142256152