Three-dimensional video processing has high computation requirements and multicore processors realized in 3-D integrated circuits (ICs) provide promising high performance computing platforms. However, the conventional approaches to accelerate the computations involved in 3-D video processing do not exploit the high performance potential of 3-D ICs. In this paper, we propose an application-driven methodology that performs efficient mapping of 3-D video applications' components on 3-D multicores to achieve high performance (throughput). The methodology involves an extensive application analysis to exploit the spatial and temporal correlation available in 3-D neighborhood. Afterward, it leverages the correlation and thermal properties of different 3-D views to perform an efficient mapping of 3-D video processing on cores available at different layers of 3-D IC. The goal is to optimize energy consumption and peak temperature while meeting the throughput requirement. Experiments show 76% reduction in communication energy along with reduction in peak temperature when compared with approaches exploiting architecture characteristics only.