Analysis and Mapping for Thermal and Energy Efficiency of 3-D Video Processing on 3-D Multicore Processors
Publikation: Beitrag in Fachzeitschrift › Forschungsartikel › Beigetragen › Begutachtung
Beitragende
Abstract
Three-dimensional video processing has high computation requirements and multicore processors realized in 3-D integrated circuits (ICs) provide promising high performance computing platforms. However, the conventional approaches to accelerate the computations involved in 3-D video processing do not exploit the high performance potential of 3-D ICs. In this paper, we propose an application-driven methodology that performs efficient mapping of 3-D video applications' components on 3-D multicores to achieve high performance (throughput). The methodology involves an extensive application analysis to exploit the spatial and temporal correlation available in 3-D neighborhood. Afterward, it leverages the correlation and thermal properties of different 3-D views to perform an efficient mapping of 3-D video processing on cores available at different layers of 3-D IC. The goal is to optimize energy consumption and peak temperature while meeting the throughput requirement. Experiments show 76% reduction in communication energy along with reduction in peak temperature when compared with approaches exploiting architecture characteristics only.
Details
Originalsprache | Englisch |
---|---|
Seiten (von - bis) | 2745-2758 |
Seitenumfang | 14 |
Fachzeitschrift | IEEE transactions on very large scale integration (VLSI) systems |
Jahrgang | 24 |
Ausgabenummer | 8 |
Publikationsstatus | Veröffentlicht - Aug. 2016 |
Peer-Review-Status | Ja |
Schlagworte
Forschungsprofillinien der TU Dresden
Ziele für nachhaltige Entwicklung
ASJC Scopus Sachgebiete
Schlagwörter
- 3-D multicore, 3-D video, design-time analysis, interconnect energy, synchronous dataflow, thermal-aware mapping, throughput