An overview of twin-flash™ technology

Research output: Contribution to conferencesPaperContributedpeer-review

Contributors

  • E. G.Stein V. Kamienski - , Infineon Technologies AG (Author)
  • M. Isler - , Infineon Technologies AG (Author)
  • T. Mikolajick - , Infineon Technologies AG (Author)
  • C. Ludwig - , Infineon Technologies AG (Author)
  • N. Schulze - , Infineon Technologies AG (Author)
  • N. Nagel - , Infineon Technologies AG (Author)
  • S. Riedel - , Infineon Technologies AG (Author)
  • J. Willer - , Infineon Technologies AG (Author)
  • K. H. Küsters - , Infineon Technologies AG (Author)

Abstract

The twin-flash cell technology relies on the charge trapping storage concept. The concept is described. The fabrication of the technology nodes ranges from 170 nm to 90 nm. The realization of the concept in different cell types is described. The shrink path beyond the 40 nm node is shown and discussed.

Details

Original languageEnglish
Pages5-10
Number of pages6
Publication statusPublished - 2005
Peer-reviewedYes
Externally publishedYes

Conference

Title2005 Non-Volatile Memory Technology Symposium, NVMTS05
Duration7 - 10 November 2005
CityDallas, TX
CountryUnited States of America

External IDs

ORCID /0000-0003-3814-0378/work/156338413

Keywords

ASJC Scopus subject areas

Keywords

  • Channel hot electron injection, Hot hole injection, Multi bit storage, Trapped charge storage devices, Twin-Flash