This paper describes design and advances in process development for UV-lithography of planar single mode waveguides with openings for out-of-plane coupling µ-mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. However, non uniformity across 4” wafer is shown due to varying proximity and UV-intensity. Openings in full stack with steep sidewalls without residual layer are patterned. Reduction in stack thickness for very small exposure doses due to inhibition even under inert atmosphere is shown. 45° -µ-mirrors are integrated in these openings to manufacture a U-link via a single mode waveguide and two adjacent micro-mirrors. Optical characterization of U-link demonstrates the feasibility of hybrid lithography approach. However, non-uniformity of core cross-section leads to cross coupling of planar waveguides. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with µ-mirror printing is given.