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A sensor detecting kissing bonds in adhesively bonded joints using electric time domain reflectometry

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

Philip Johannes Steinbild - , Institute of Lightweight Engineering and Polymer Technology (Author)
Robin Höhne - , Institute of Lightweight Engineering and Polymer Technology (Author)
René Füßel - , Institute of Lightweight Engineering and Polymer Technology (Author)
Niels Modler - , Chair of Function-integrative Leightweight Engineering (Author)

Details

Original language	English
Pages (from-to)	114-119
Number of pages	6
Journal	NDT and E International
Volume	102
Early online date	22 Nov 2018
Publication status	Published - Mar 2019
Peer-reviewed	Yes

External IDs

Scopus	85059459133
ORCID	/0000-0003-2834-8933/work/142238208
ORCID	/0000-0003-1385-1528/work/142240110

Keywords

Keywords

Electric time domain reflectometry, non-destructive testing, digital image correlation, kissing bond, adhesively bonded joint, fiber reinforced plastics