A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils

Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review

Contributors

  • Nagarajan Palavesam - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT), TUD Dresden University of Technology (Author)
  • Christof Landesberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Christoph Kutter - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, TUD Dresden University of Technology (Author)

Abstract

We present a new test method developed, by merging Acoustic Emission testing and Ball-Breaker Test, to study the fracture strength of very small, ultra-thin chips integrated in foils. The test method is particularly useful for strength and mechanical reliability assessment of components for wearables, flexible electronics and portable devices. Statistical results from the breaking tests revealed an increase in robustness of the ultra-thin chips of up to 300% due to embedding in foils.

Details

Original languageEnglish
Title of host publicationSmart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2016
EditorsT. Gessner
PublisherVerlag Wissenschaftliche Scripten
Pages122-129
Number of pages8
ISBN (electronic)9783957350404
Publication statusPublished - 2016
Peer-reviewedYes

Publication series

SeriesSmart Systems Integration Conference

Conference

TitleSmart Systems Integration 2016 - 10th International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2016
Duration9 - 10 March 2016
CityMunich
CountryGermany

External IDs

ORCID /0000-0002-0757-3325/work/139064927

Keywords

ASJC Scopus subject areas