We present a new test method developed, by merging Acoustic Emission testing and Ball-Breaker Test, to study the fracture strength of very small, ultra-thin chips integrated in foils. The test method is particularly useful for strength and mechanical reliability assessment of components for wearables, flexible electronics and portable devices. Statistical results from the breaking tests revealed an increase in robustness of the ultra-thin chips of up to 300% due to embedding in foils.