2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Activity: Organising or participating in an event › Organising an event
Persons and affiliations
- Peter Schneider - , Chair of Design Methods for Adaptive Microelectronic Systems (Session host)
Date
1 Jun 2025 → 4 Jun 2025
Description
Mitorganisation der Tagung - in Kooperation mit Fraunhofer IIS/EAS, Universität Paris-Saclay, CNRS, University of SplitConference
| Title | 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
|---|---|
| Abbreviated title | DTIP 2025 |
| Conference number | 27 |
| Duration | 1 - 4 June 2025 |
| Degree of recognition | International event |
| City | Split |
| Country | Croatia |