Mayer, D., Lehmann, M., Beyer, V., Schneider, A. & Schneider, P., 2 Jun 2024, 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2024.p. 1 - 6 (Design, Test, Integration and Packaging of MEMS/MOEMS).
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review