This study investigates the feasibility of utilizing polymer paste as a dielectric material for module-to-module sintering in printed circuit board (PCB) assemblies. Known methods of connecting modules in PCB assemblies typically involve soldering. In contrast, sintering presents a promising alternative to bond materials used at lower temperatures. Sintering connections are characterized by high reliability, durability, and high temperature resistance. By integrating polymer paste as a dielectric material, this research aims to merge the sintering with the dielectric layer within a simultaneous lamination process and to support the improved thermal performance of sinter interconnects at use conditions. The one-step process approach is comparable to a joining process of sintering with subsequent underfilling. The dielectric layer must well adhere to the materials of the PCB. Hence, the adhesion of the dielectric layer is investigated on both copper and FR4 surfaces of the module-to-module connection. Shear force investigations reveal higher adhesion of the dielectric layer to copper compared to FR4, with potential enhancements using different dielectric materials. Furthermore, different material combinations and different lamination process parameters are investigated indicating further process improvements.