Microprinting process development enabling cost effective, high density and flexible electro-optical integration

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

To overcome the interconnect bottlenecks of chip-to-chip (C2C) data communication, we aim for an electro-optical integration approach combining electrical and optical interconnects for contacting and routing signals in electronic systems. This paper describes the development of additive microprinting manufacturing processes for the fabrication of optical routing and coupling using the multi-lithography approach with UV-lithography, two-photon direct laser writing (2PP-DLW) and UV nano-imprinting (UV-NIL). Multimode and single-mode application scenarios for micro-structuring of ORMOCER® hybrid polymers and 2PP printing resins are discussed: the multichannel and multimode flexible optical links for 5G/6G base stations servers and the E/O-hybrid interposer for SiN-based photonic enabled trusted electronics with single-mode planar BEOL optics. The advances in 2PP-DLW and UV-NIL processes are described and the influence of processing parameters on the quality of manufactured optics is evaluated in the paper.

Details

OriginalspracheDeutsch
Titel2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Herausgeber (Verlag)IEEE
Seiten1790-1796
Seitenumfang7
ISBN (elektronisch)9798350375985
ISBN (Print)979-8-3503-7599-2
PublikationsstatusVeröffentlicht - 31 Mai 2024
Peer-Review-StatusJa

Konferenz

Titel2024 IEEE 74th Electronic Components and Technology Conference
KurztitelECTC 2024
Veranstaltungsnummer74
Dauer28 - 31 Mai 2024
OrtGaylord Rockies Resort & Convention Center
StadtDenver
LandUSA/Vereinigte Staaten

Externe IDs

Scopus 85197703076
ORCID /0000-0002-0757-3325/work/165062965

Schlagworte

Schlagwörter

  • Optical device fabrication, Optical interconnections, Printing, Routing, Servers, Waveguide lasers, Writing