Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
Aktivität: Vortrag oder Präsentation an externen Einrichtungen/Veranstaltungen › Vortrag › Beigetragen
Personen und Einrichtungen
- Akash Sunilkumar Mistry - , Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT), Professur für Aufbau- und Verbindungstechnik der Elektronik (Redner:in)
- Krzysztof Kamil Nieweglowski - , Professur für Aufbau- und Verbindungstechnik der Elektronik (Beteiligte Person)
- Karlheinz Bock - , Professur für Aufbau- und Verbindungstechnik der Elektronik (Beteiligte Person)
Datum
6 Juli 2023
Beschreibung
the presented work demonstrates the fabrication process of the master for nano-imprint lithography (NIL) stamp for multi-mode waveguide (MM-WG) with μ-mirror using hybrid-lithography, which includes a 2-photon-polymerization direct laser writing process (2PP-DLW) for μ-mirror surface and UV-photo lithography for MM-WGs. For the definition of the mirror surface at either end of waveguides in the master stamp, the 2PP-DLW process was used. It offers a lower surface roughness (< 0.1 λ) with fewer processing steps, alignment accuracy of ± 1 μm, prints fine and sharp contours, and relatively faster scanning for a specific material, which makes it the foremost technology over the traditional micro-mirror processes such as the dicing process, moving mask lithography, laser ablation, wet etching, and dry etching. For the fabrication of the waveguide core with rectangular cross-sections in the master stamp, UV mask exposure with SU-8 was used. It is a mass-production and low-cost technique. It gives a smooth structure with 90-degree sidewalls compared to other processes like dry etching, wet etching, mosquito method, and E-beam writing. We demonstrated the design and process of a master pattern with a density range from 0.04 to 0.2 to maintain equal pressure over the stamp in the NIL step for an almost uniform residual thickness layer.Konferenz
Titel | 2023 46th International Spring Seminar on Electronics Technology |
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Untertitel | Revolutionizing the Electronics Ecosystems - Chiplet and Heterogeneous Integration |
Kurztitel | ISSE 2023 |
Veranstaltungsnummer | 46 |
Dauer | 10 - 14 Mai 2023 |
Webseite | |
Ort | Politehnica University of Timisoara |
Stadt | Timisoara |
Land | Rumänien |
Schlagworte
Fächergruppen, Lehr- und Forschungsbereiche, Fachgebiete nach Destatis
Schlagwörter
- multi-mode waveguides (MM-WGs), micro-mirror, two-photon polymerization direct laser writing (2PP-DLW), UV lithography, hybrid-lithography