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Research output: Contribution to journal › Editorial (Lead article) › Contributed › peer-review

Contributors

Michael Mayer - , University of Waterloo (Author)
Karlheinz Bock - , Chair of Electronic Packaging Technology, TUD Dresden University of Technology (Author)

Original language	English
Pages (from-to)	lxxv-lxxvi
Journal	Proceedings - Electronic Components and Technology Conference
Publication status	Published - 2024
Peer-reviewed	Yes

Title	2024 IEEE 74th Electronic Components and Technology Conference
Abbreviated title	ECTC 2024
Conference number	74
Duration	28 - 31 May 2024
Location	Gaylord Rockies Resort & Convention Center
City	Denver
Country	United States of America

ORCID	/0000-0002-0757-3325/work/165454413