Verfahren und Vorrichtung zum Einbetten mindestens eines elektronischen Bauelements in einem Träger
Research output: Intellectual property › Patent application/Patent
Contributors
Abstract
The present invention relates to a method and a device for embedding at least one electronic component (1) into a substrate (2). In this respect, the at least one component (1) is fixed in or on a receiving unit (3), and the substrate (2) is produced by applying a substrate material into or onto the receiving unit (3) in layers, the at least one component (1) being embedded into the substrate material as the result of said application in layers.
Translated title of the contribution | METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE |
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Details
The present invention relates to a method and a device for embedding at least one electronic component (1) into a substrate (2). In this respect, the at least one component (1) is fixed in or on a receiving unit (3), and the substrate (2) is produced by applying a substrate material into or onto the receiving unit (3) in layers, the at least one component (1) being embedded into the substrate material as the result of said application in layers.
Original language | German |
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IPC (International Patent Classification) | H05K 3/ 14 A I |
Patent number | WO2018146130A1 |
Country/Territory | Germany |
Priority date | 8 Feb 2017 |
Priority number | DE201710202000 |
Publication status | Published - 16 Aug 2018 |
External IDs
ORCID | /0000-0002-0757-3325/work/142660451 |
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