Verfahren und Vorrichtung zum Einbetten mindestens eines elektronischen Bauelements in einem Träger

Tobias Tiedje; Sebastian Lüngen; Martin Schubert; Krzystof Nieweglowski; Karl-Heinz Bock; Diego Betancourt; Frank Ellinger; Niels Neumann; Bernhard Klein; Patrick Sascha Seiler; Dirk Plettemeier

Contributors

Tobias Tiedje - , Institute of Electronic Packaging Technology (Inventor)
Sebastian Lüngen - , Institute of Electronic Packaging Technology (Inventor)
Martin Schubert - , Institute of Electronic Packaging Technology (Inventor)
Krzystof Nieweglowski - , Institute of Electronic Packaging Technology (Inventor)
Karl-Heinz Bock - , Institute of Electronic Packaging Technology (Inventor)
Diego Betancourt - , Chair of Circuit Design and Network Theory (Inventor)
Frank Ellinger - , Chair of Circuit Design and Network Theory (Inventor)
Niels Neumann - , Chair of Radio Frequency and Photonics Engineering (Inventor)
Bernhard Klein - , Chair of Radio Frequency and Photonics Engineering (Inventor)
Patrick Sascha Seiler - , Chair of Radio Frequency and Photonics Engineering (Inventor)
Dirk Plettemeier - , Chair of Radio Frequency and Photonics Engineering (Inventor)

Abstract

The present invention relates to a method and a device for embedding at least one electronic component (1) into a substrate (2). In this respect, the at least one component (1) is fixed in or on a receiving unit (3), and the substrate (2) is produced by applying a substrate material into or onto the receiving unit (3) in layers, the at least one component (1) being embedded into the substrate material as the result of said application in layers.

Translated title of the contribution	METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE

Details

The present invention relates to a method and a device for embedding at least one electronic component (1) into a substrate (2). In this respect, the at least one component (1) is fixed in or on a receiving unit (3), and the substrate (2) is produced by applying a substrate material into or onto the receiving unit (3) in layers, the at least one component (1) being embedded into the substrate material as the result of said application in layers.

Original language	German
IPC (International Patent Classification)	H05K 3/ 14 A I
Patent number	WO2018146130A1
Country/Territory	Germany
Priority date	8 Feb 2017
Priority number	DE201710202000
Publication status	Published - 16 Aug 2018

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External IDs

ORCID	/0000-0002-0757-3325/work/142660451

Keywords

Research priority areas of TU Dresden

Information Technology and Microelectronics