Thermal Influence on the Mechanical Properties of Cardboard during an Ultrasonic-Assisted Embossing Process

Research output: Contribution to journalResearch articleContributedpeer-review

Contributors

Details

Original languageEnglish
Pages (from-to)5110-5121
Number of pages12
JournalBioResources
Issue number3
Publication statusPublished - 2020
Peer-reviewedYes

Keywords

ASJC Scopus subject areas

    Keywords

    • Heat, Paper, Sample Thickness, Roughness, Mechanical properties, Ultrasound, Cardboard, Bending stiffness, Compressibility, Tensile Strength, Visual analysis, Embossing