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Thermal Influence on the Mechanical Properties of Cardboard during an Ultrasonic-Assisted Embossing Process

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

Ulrike Käppler - , Leipzig University of Applied Sciences (Author)
Jennes Hünniger - , Chair of Processing Machines/ Processing Technology, Leipzig University of Applied Sciences (Author)
André Hofmann - , Chair of Processing Machines/ Processing Technology (Author)
Andrea Berlich - , Leipzig University of Applied Sciences (Author)
Lutz Engisch - , Leipzig University of Applied Sciences (Author)

Details

Original language	English
Pages (from-to)	5110-5121
Number of pages	12
Journal	BioResources
Volume	15
Issue number	3
Publication status	Published - 2020
Peer-reviewed	Yes

External IDs

Scopus	85088433612

Keywords

Keywords

Heat, Paper, Sample Thickness, Roughness, Mechanical properties, Ultrasound, Cardboard, Bending stiffness, Compressibility, Tensile Strength, Visual analysis, Embossing