Spatially resolved cure monitoring of SMC by electrical time-domain reflectometry

Research output: Contribution to journalConference articleContributedpeer-review

Abstract

Press-processing of sheet molding compounds (SMC) is a technology for series production of lightweight structures providing elevated mechanical properties. The degree of homogeneity produced during the curing of the thermoset material poses a significant challenge to further technological advancement. This contribution presents a new monitoring method that allows spatially resolved Electrical Time Domain Reflectometry (ETDR) measurements during curing of an SMC. The results show local changes of the impedance along the sensor that can be correlated to the degree of cure (DOC). Two heating cycles are compared. While during the first cycle curing of the SMC takes place, the second cycle serves to detect the heating behavior of the cured part. By analyzing the differences between both cycles, values for the local DOC can be derived. To validate the suggested approach, differential scanning calorimetry (DSC) scans are performed. The results show that ETDR is a promising tool for in-situ process monitoring of thermoset based production technologies. It provides comprehensive data while being a cost-effective and flexible method.

Details

Original languageEnglish
Pages (from-to)49-55
Number of pages7
JournalProcedia Computer Science
Volume276
Publication statusPublished - 20 Mar 2026
Peer-reviewedYes

Conference

Title7th International Conference on System-Integrated Intelligence
Abbreviated titleSysInt 2025
Conference number7
Duration4 - 6 June 2025
Website
LocationATLANTIC Hotel Universum Bremen
CityBremen
CountryGermany

External IDs

ORCID /0000-0002-8854-7726/work/210351410
ORCID /0000-0003-1370-064X/work/210353817
ORCID /0000-0002-0110-3066/work/210354225
ORCID /0000-0003-0152-348X/work/210354256
ORCID /0000-0003-1385-1528/work/210354382
ORCID /0000-0003-3624-3242/work/210354485
ORCID /0009-0001-7932-7086/work/210355834

Keywords

Keywords

  • sheet molding compound, electrical time-domain reflectometry, degree of cure, differential scanning calorimetry