Solid Body and Multi-Component Arrangement

Research output: Intellectual property › Patent application/Patent

Contributors

  • Wolfram Drescher - (Inventor)
  • Marko David Swoboda - , Infineon Technologies AG (Inventor)
  • Ralf Rieske - , Infineon Technologies AG (Inventor)
  • Christian Beyer - (Inventor)
  • Jan Richter - (Inventor)
  • Siltectra GmbH

Abstract

A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.

Details

A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.

Original languageEnglish
IPC (International Patent Classification)H01L 21/ 324 A I
Patent numberUS2021225659
Filing date22 Mar 2021
Country/TerritoryUnited States of America
Priority date22 Mar 2021
Priority numberUS202117207894
Publication statusPublished - 22 Jul 2021
Externally publishedYes
No renderer: customAssociatesEventsRenderPortal,dk.atira.pure.api.shared.model.researchoutput.Patent

External IDs

ORCID /0000-0003-2572-1149/work/208796501