Solid Body and Multi-Component Arrangement

Publikation: Geistiges EigentumPatentanmeldung/Patent

Beitragende

  • Wolfram Drescher - (Erfinder:in)
  • Marko David Swoboda - , Infineon Technologies AG (Erfinder:in)
  • Ralf Rieske - , Infineon Technologies AG (Erfinder:in)
  • Christian Beyer - (Erfinder:in)
  • Jan Richter - (Erfinder:in)
  • Siltectra GmbH

Abstract

A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.

Details

A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.

OriginalspracheEnglisch
IPC (Internationale Patentklassifikation)H01L 21/ 324 A I
VeröffentlichungsnummerUS2021225659
Anmeldedatum22 März 2021
Land/GebietUSA/Vereinigte Staaten
Prioritätsdatum22 März 2021
PrioritätsnummerUS202117207894
PublikationsstatusVeröffentlicht - 22 Juli 2021
Extern publiziertJa
No renderer: customAssociatesEventsRenderPortal,dk.atira.pure.api.shared.model.researchoutput.Patent

Externe IDs

ORCID /0000-0003-2572-1149/work/208796501