Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
The paper reports on a self-assembly process that enables both self-alignment of microelectronic devices and self-interconnection of devices with the surrounding electrical wiring. The complete process was successfully demonstrated using state-of-the-art RFID devices (radio frequency identification device) which were self-connected to four metal pads on polymer foil substrates. The new self-assembly concept comprises the following steps: mask-less plasma patterning process to define target areas for die assembly on polymer tapes, application and self-alignment of a liquid assembly medium at the target area, dropping of the chip device onto the assembly liquid, self-orientation of the chip with respect to the contact pads and finally heat induced bonding and interconnection of the device.
Details
Original language | English |
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Title of host publication | 3rd Electronics System Integration Technology Conference ESTC |
Place of Publication | Berlin |
Publisher | IEEE Xplore |
ISBN (electronic) | 978-1-4244-8554-3, 978-1-4244-8555-0 |
ISBN (print) | 978-1-4244-8553-6 |
Publication status | Published - 2010 |
Peer-reviewed | Yes |
Publication series
Series | Electronics System-Integration Technology Conference, ESTC |
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ISSN | 2687-9700 |
Conference
Title | 3rd Electronics System Integration Technology Conference, ESTC 2010 |
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Duration | 13 - 16 September 2010 |
City | Berlin |
Country | Germany |
External IDs
ORCID | /0000-0002-0757-3325/work/139064955 |
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