Reliability characterization of blind-hole vias for a System-in-Foil

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Contributors

  • Enno Lorenz - , Robert Bosch GmbH (Author)
  • Nils Niemann - , Robert Bosch GmbH (Author)
  • Metin Koyuncu - , Robert Bosch GmbH (Author)
  • Karlheinz Bock - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Abstract

In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of real-time electrical measurements during bending. A significant improvement of the bending stability is achieved with the plasma treatment process, while the main failure mechanism for the non-plasma treated samples is delamination at the pad-adhesive interface.

Details

Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-integration Technology Conference (ESTC)
Place of PublicationHelsinki
PublisherIEEE Xplore
Pages1-6
Number of pages6
ISBN (print)978-1-4799-4026-4
Publication statusPublished - 18 Nov 2014
Peer-reviewedYes
Externally publishedYes

Publication series

SeriesElectronics System-Integration Technology Conference, ESTC
ISSN2687-9700

Conference

Title5th Electronics System-Integration Technology Conference, ESTC 2014
Duration16 - 18 September 2014
CityHelsinki
CountryFinland

External IDs

Scopus 84918585767
ORCID /0000-0002-0757-3325/work/139064853

Keywords

ASJC Scopus subject areas

Keywords

  • Plasmas, Resistance, Reliability, Surface treatment, Materials, Conductive adhesives, Filling

Library keywords