Reliability characterization of blind-hole vias for a System-in-Foil

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • Enno Lorenz - , Robert Bosch GmbH (Autor:in)
  • Nils Niemann - , Robert Bosch GmbH (Autor:in)
  • Metin Koyuncu - , Robert Bosch GmbH (Autor:in)
  • Karlheinz Bock - , Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien (Autor:in)

Abstract

In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of real-time electrical measurements during bending. A significant improvement of the bending stability is achieved with the plasma treatment process, while the main failure mechanism for the non-plasma treated samples is delamination at the pad-adhesive interface.

Details

OriginalspracheEnglisch
TitelProceedings of the 5th Electronics System-integration Technology Conference (ESTC)
ErscheinungsortHelsinki
Herausgeber (Verlag)IEEE Xplore
Seiten1-6
Seitenumfang6
ISBN (Print)978-1-4799-4026-4
PublikationsstatusVeröffentlicht - 18 Nov. 2014
Peer-Review-StatusJa
Extern publiziertJa

Publikationsreihe

ReiheElectronics System-Integration Technology Conference, ESTC
ISSN2687-9700

Konferenz

Titel5th Electronics System-Integration Technology Conference, ESTC 2014
Dauer16 - 18 September 2014
StadtHelsinki
LandFinnland

Externe IDs

Scopus 84918585767
ORCID /0000-0002-0757-3325/work/139064853

Schlagworte

Schlagwörter

  • Plasmas, Resistance, Reliability, Surface treatment, Materials, Conductive adhesives, Filling