Plasmachemisches Ätzen und Beschichten bei Atmosphärendruck: Anwendungen in der kristallinen Siliziumphotovoltaik

Research output: Contribution to journalResearch articleContributedpeer-review

Contributors

  • Elena Lopez - , Fraunhofer Institute for Material and Beam Technology (Author)
  • Dorit Linaschke - , Fraunhofer Institute for Material and Beam Technology (Author)
  • Birte Dresler - , Fraunhofer Institute for Material and Beam Technology (Author)
  • Ines Dani - , Fraunhofer Institute for Material and Beam Technology (Author)
  • Christoph Leyens - , Chair of Materials Technology, Fraunhofer Institute for Material and Beam Technology (Author)
  • Eckhard Beyer - , Chair of Laser and Surface Technology, Fraunhofer Institute for Material and Beam Technology (Author)

Abstract

For industrial processing of wafer based crystalline silicon solar cells a variety of different technologies are applied. The combination of these requires a complex wafer handling; increasing not only investment costs, but also the risk of wafer breakage. Application of plasma technologies offers the possibility to manufacture crystalline silicon solar cells without any wet chemical or vacuum processes. At Fraunhofer IWS all etching steps necessary for the production of solar cells and the deposition of silicon nitride as passivation and anti-reflection coating were demonstrated successfully using atmospheric pressure plasma technologies.

Translated title of the contribution
Atmospheric pressure plasma-chemical etching and deposition. Application in crystalline silicon photovoltaics

Details

Original languageGerman
Pages (from-to)12-16
Number of pages5
JournalVakuum in Forschung und Praxis
Volume23
Issue number6
Publication statusPublished - Dec 2011
Peer-reviewedYes

Keywords