Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices

Research output: Intellectual property › Patent application/Patent

Contributors

  • Ralf Rieske - , Infineon Technologies AG (Inventor)
  • Alexander Binter - (Inventor)
  • Wolfgang Diewald - (Inventor)
  • Bernhard Goller - (Inventor)
  • Heimo Graf - (Inventor)
  • Gerald Lackner - (Inventor)
  • Jan Richter - (Inventor)
  • Roland Rupp - (Inventor)
  • Guenter Schagerl - (Inventor)
  • Marko David Swoboda - , Infineon Technologies AG (Inventor)

Abstract

Provided is a machining apparatus including a profile sensor unit configured to obtain shape information about a parent substrate; and a laser scan unit configured to direct a laser beam onto the parent substrate, wherein a laser beam axis of the laser beam is tilted to an exposed main surface of the parent substrate, and wherein a track of the laser beam on the parent substrate is controllable as a function of the shape information obtained from the profile sensor unit.

Details

Provided is a machining apparatus including a profile sensor unit configured to obtain shape information about a parent substrate; and a laser scan unit configured to direct a laser beam onto the parent substrate, wherein a laser beam axis of the laser beam is tilted to an exposed main surface of the parent substrate, and wherein a track of the laser beam on the parent substrate is controllable as a function of the shape information obtained from the profile sensor unit.

Original languageEnglish
IPC (International Patent Classification)H01L 21/ 78 A I
Patent numberUS2023330769
Filing date16 Jun 2023
Country/TerritoryUnited States of America
Priority date16 Jun 2023
Priority numberUS202318336643
Publication statusPublished - 19 Oct 2023
Externally publishedYes
No renderer: customAssociatesEventsRenderPortal,dk.atira.pure.api.shared.model.researchoutput.Patent

External IDs

ORCID /0000-0003-2572-1149/work/208796497